可实现0.3mm至1.27 mm间距的BGA，LGA，QFN、QFP 和SOIC器件的高耐久性和大范 围温度差的测试，或其他不同要求的测试应用，并提供出色的信号完整性，可在 >40G Hz的条件下保持信号的低损耗。工厂同韩国专业治具公司合资生产。
Enables testing of BGA, LGA, QFN, QFP and SOIC devices with a pitch of 0.3mm to 1.27 mm for high durability and large temperature differences, or other test applications with different requirements, and provides excellent signal integrity to maintain low signal loss at >40G Hz. Factory with South Korea professional fixture company joint venture production.
