环氧模塑料，即环氧树脂模塑料、环氧塑封料，是酚醛树脂为固由环氧树脂为基体树脂， 以 高性能化剂，加入硅微粉等为填料， 以及添加多种助剂混配而成的粉状模塑料。用于半导体封装模封工序。 Epoxy molding plastics, that is, epoxy resin molding plastics, epoxy plastic sealing materials, phenolic resin is a solid epoxy resin as a matrix resin, with high performance agents, the addition of silicon powder and other fillers, and add a variety of additives mixed into the powder molding plastics. It is used in the mold sealing process of semiconductor packaging.
